Electromigration Modeling at Circuit Layout Level by Cher Ming Tan
English | PDF | 2013 | 111 Pages | ISBN : 9814451207 | 6.8 MB
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability.