Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging by John H. Lau
English | EPUB (True) | 2023 | 542 Pages | ISBN : 9811999163 | 316.3 MB
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Please If You Want To Support Me Kindly Purchase Premium From Any Of My Blog Download Links Thanks For Supporting Me And Purchasing Premium From My Links
We Are Here For You And Without You And Your Support We Can’t Continue Thanks For Buying Premium From My Links For Support
We Are Here For You And Without You And Your Support We Can’t Continue Thanks For Buying Premium From My Links For Support