Electrical Conductive Adhesives with Nanotechnologies (Repost)
Yi Li, Daniel Lu, C.P. Wong, "Electrical Conductive Adhesives with Nanotechnologies"
2009 | pages: 445 | ISBN: 0387887822 | PDF | 22,2 mb
2009 | pages: 445 | ISBN: 0387887822 | PDF | 22,2 mb
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
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